Advanced System-in-Package (SiP) Technology 2022

刊登日期：2022-02-15 | 資料來源：https://www.imaps.org/advanced_system-in-packaging.php

活動日期	June 21-23, 2022
活動地點	Doubletree by Hilton Sonoma, California USA
主辦單位	International Microelectronics Assembly and Packaging Society (IMAPS)

See attached file for sponsor and exhibitor information.

附件檔案：

檔案名稱	檔案大小	檔案格式	刊登日期	檔案下載
IMAPS_Advanced_SiP_2022_Sponsor_and_Exhibitor_Prospectus.pdf	957K	pdf	2022-02-15

	Advanced Packaging for Medical Microelectronics

	Call For Papers-IMPACT 2024 (Deadline: 2024/06/23)

Advanced Packaging for Medical Microelectronics