PAPER SUBMISSION

  IMPACT 2023 Conference, organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year's event will be held from Oct. 25th-27th at Taipei Nangang Exhibition Center in conjunction with TPCA Show 2023. The symposium will focus on the theme “IMPACT on the future of HPC, AI, and Metaverse", exploring the latest electronic technologies and fostering collaboration among enterprises and organizations.

The rapid development of HPC, AI, and Metaverse technologies will revolutionize existing technologies, connecting people in new ways and redefining our lives. To provide a valuable platform for these innovations, IMPACT 2023 will host plenary speeches, special sessions, industrial sessions, invited talks, outstanding papers, and poster presentations. This conference also collaborates with international organizations such as ICEP and JIEP from Japan, iNEMI and IEEE EPS from the USA, and global consulting companies like Yole Développement and Techsearch from the USA. Join us at IMPACT 2023 to be part of the future of electronics technology!

Scope of Paper Solicited

*Scope covers from PACKAGING TO PCB; papers relevant to the below scopes are encouraged to submit but NOT limited to.

Important Date

For more information, please visit IMPACT 2023.