The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society ( IMAPS) and held in Boston, Massachusetts.

This  year's program features 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on Design, Modeling and Manufacturing; Fanout, RDL, WLP / PLP; High Performance / High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technology).