Interesting in joining HiTEN 2026?
September 29 - october 2, 2025
ADDRESSING THE CHALLENGES AND OPPORTUNITIES FOR ENABLING BROADER ADOPTION OF CHIPLET ARCHITECTURES
Making devices that are defect-free and able to withstand years of harsh environments is made more difficult by a combination of low volume and high complexity.
2025.03.12
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.