New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
2025.06.03
Manufacturers are turning to automation, AI, and robotics to boost repeatability, cut costs, and support heterogeneous integration.
The economics are not yet clear for industrial or consumer electronics.
New materials play a pivotal role, but solving integration problems remains a challenge.
Evolving lithography demands are challenging mask writing technology; shift to curvilinear is underway.
Heat pipes, lids, thermal interfaces, and micro-channel cooling help remove the heat generated by chips.
Making devices that are defect-free and able to withstand years of harsh environments is made more difficult by a combination of low volume and high complexity.
2025.03.12
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.
Hardware advances have addressed some of the problems. The next step may hinge on the algorithms.
Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of tradeoffs will be necessary.
A chiplet supermarket is still years off, but progress is being made on all fronts.
2025.02.11
