Making devices that are defect-free and able to withstand years of harsh environments is made more difficult by a combination of low volume and high complexity.
2025.03.12
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.
Hardware advances have addressed some of the problems. The next step may hinge on the algorithms.
Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of tradeoffs will be necessary.
A chiplet supermarket is still years off, but progress is being made on all fronts.
2025.02.11
Assembly design kits will greatly increase efficiency, but custom methods prevail for now.
Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
Brewer Science’s new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties in advanced packaging.
Novel combinations show promise for different applications.
Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging
Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.
2025.01.08
