2025.04.10
【演講公告】IEEE EPS Taipei Chapter Distinguished Lecture
Co-Packaged Optics – 3D Heterogeneous Integration of Photonic IC and Electronic IC
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2025.01.23
Advanced Packaging Process and Power IC: Online Seminar
This IMAPS Taiwan online seminar on Advanced Packaging Technologies will delve into the cutting-edge innovations in the field, including hybrid bonding, multi-chip integration, and SiC power modules.
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