感謝大家熱情參與!本次研討會議人數高達98人!!

當日研討會簡報已放置在會員專區，點選下載資料就可以看到囉!(須先加入會員)

再次感謝所有講師與我們分享如此棒的演講!

This IMAPS Taiwan online seminar on Advanced Packaging Technologies will delve into the cutting-edge innovations in the field, including hybrid bonding, multi-chip integration, and SiC power modules.

We are privileged to have Professor HC Cheng (鄭仙志特聘教授) as our esteemed guest speaker. Furthermore, we are delighted to welcome industry experts from ITRI: Dr. HH Chang (張香鈜經理) and Dr. C-C Hsiao (蕭志誠經理), who will share their valuable insights on hybrid bonding and multi-chip advanced packaging integration.

This seminar will serve as a valuable platform for IMAPS Taiwan experts to collectively explore the latest advancements, address the challenges, and envision the future trajectory of this transformative field.