Co-Packaged Optics – 3D Heterogeneous Integration of Photonic IC and Electronic IC

Silicon photonics are the semiconductor integration of EIC and PIC on a silicon substrate (wafer) with complementary metal-oxide semiconductor (CMOS) technology. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) and the electrical engine (EE) which consists of the electronic ICs (EIC) as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of a higher level of heterogeneous integration of PIC and EIC, whether it is for performance, form factor, power consumption or cost. The content of this lecture is shown below.

o   Silicon Photonics

o   Data Centers

o   Optical Transceivers

o   Optical Engine (OE) and Electrical Engine (EE)

o   OBO (on-board optics)

o   NPO (near-board optics)

o   CPO (co-packaged optics)

o   3D Integration of the PIC and EIC

o   3D Heterogeneous Integration of PIC and EIC

o   3D Heterogeneous Integration of ASIC Switch, PIC and EIC

o   3D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges

o   3D Heterogeneous Integration of ASIC Switch, EIC and PIC embedded in Glass-core Substrate

o   Summary and Recommendations

 

• Bio of Dr. John Lau:

John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 24 textbooks. John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.

 

• Who Should Attend?

If you (students, engineers, and managers) are involved with any aspect of the electronics industry, you should attend this course. It is equally suited for R&D professionals and scientists. The lectures are based on the publications by many distinguish authors and the books (by the lecturer). Each attendee will receive more than 150 pages of lecture notes

 

• 演講時間

日期：2025年6月18日（星期三）

時間：10:00至12:00

 

• 演講地點

臺北市羅斯福路四段1號臺大工綜館國際演講廳203室
(地圖連結https://www.ntu.edu.tw/about/map.html)

 

• 參加方式

實體現場演講, 此次演講將向所有人免費開放，因現場座位有限，請提前報名。

報名網址連結: https://forms.gle/EA5Sq7EBijbHH6jL9

 

• 聯絡資訊

如有任何疑問，請聯絡活動籌辦組吳喬如小姐：

Email： unawu@ntu.edu.tw

期待與您在演講現場見面！