IMAPS Symposium 2025
- Full program opening 1-2 weeks!
- 4 Keynotes (NXP, Intel, AMD, UCLA),
- 18 PDCs + 3-4 new with Thermal ,
- Monday Panels + Evening Panel by Jan Vardaman
- Several invited sessions including special international sessions
- IMAPS Europe: European Advanced Packaging Pilot Line APECS (Martin, Charlie, Jens)
- IMAPS Japan/ICEP: AIST, Tohoku Univ, Furukawa, Yokohama Univ, ASRA, ICEP Best paper?
- Exhibit & Sponsor filling quickly – record # sponsors, 90+ booths sold
- Student opportunities – High School Program, University booths, & more
- www.imaps2025.org
