Thermal management is becoming an increasingly important area for semiconductor packaging, and there are many new developments in semiconductor design (chip and package), thermal interface materials, various cooling technologies (heat spreader, heat sink, vapor chamber, immersive cooling, cold plate, 2-phase cooling, jet impingement), measurement and characterization, etc. This conference will bring together participants from around the world, from academia, research institutions, and industry (fabless, IDM, OSAT, materials, cooling modules, etc.), into a conference for a focused exchange and in-depth interactions.  Planned sessions will include, but are not limited to: 

• Semiconductor thermal management requirements & challenges (AI, HPC, data centers, etc)
• Package design optimization for thermal performance
• Thermal interface materials
• Cooling modules
• Characterization & performance testing
• Modeling & simulation
• New methodologies
• Case studies
• Technology trends

A 250+ word abstract must be submitted electronically BEFORE June 10, 2025, using the on-line submittal form here. Full written papers are encouraged but not required. Technical presentations are 25-minutes + 5-minute Q&A.  All speakers are required to pay a reduced registration fee and should plan to attend the entire conference to make the presentation in-person. Please contact Kristie Bowman by email at kbowman@imaps.org if you have questions or need assistance submitting an abstract. 

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