Assembly design kits will greatly increase efficiency, but custom methods prevail for now.
2025.02.11
Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
Brewer Science’s new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties in advanced packaging.
Novel combinations show promise for different applications.
Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging
Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.
2025.01.08
Manufacturability of an MP18 semi-damascene flow containing 9nm CD Ru lines and FSAV.
Stacking layers means a complete architecture rethink.
2024.12.27
No single material is ideal, but unique combinations are emerging.
But manufacturing reliable 3D DRAM stacks with good yield is complex and costly.
Efficient methods for ESD verification of 2.5D and 3D-ICs.
2024.12.16
As feature sizes shrink and device densities increase, ensuring that masks remain defect-free becomes critical.
